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Consumer Electronics, Electronics, Technology, GeorgiaTech

- Mar 23, 2020

Room-Temperature Bonded Interface

Pollyanna Sidell - Associated Environmental Systems

room-temperature-bonding-1A room-temperature bonding technique for integrating wide bandgap materials such as gallium nitride (GaN) with thermally-conducting materials such as diamond could boost the cooling effect on GaN devices and facilitate better performance through higher power levels, longer device lifetime, improved reliability and reduced manufacturing costs.

CREDIT: ROB FELT, GEORGIA TECH

Read the source article at EurekAlert! Science News

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