When your product needs to be tested for immediate temperature changes between hot and cold repeatedly, consider a thermal shock test chamber. The SM Series test chamber makes it possible to quickly and autonomously transfer test specimens back and forth.
Used often for the testing of electronics and electronic components in automotive, aerospace and defense industries. With the popularity growth of portable and handheld electronic devices that face extreme outdoor conditions, the use of thermal shock test chambers have expanded into new industries.
To achieve the rapid change in temperature, your product sits in a pneumatically-controlled basket that travels vertically between two zones within seconds. The exterior chamber construction includes a powder-coat finish over heavy-gauge steel and type 304 stainless steel on the inside. Sandwiched between is a layer of highly-efficient, low K factor, thermal insulation for the highest efficiency and temperature performance.
Cooling differences between 1900 models and 2900 models
Each compartment holds your desired temperature with a heated zone and a cold zone. The specially designed basket is a traveling workspace with its own sensor so you can monitor not only the environmental condition in each zone but also the temperature of the specimen and recovery time. View a video of the SM Series Thermal Shock Chamber in action here.
A third zone can be added between the hot and cold zones for ambient temperature exposure.
The most common thermal shock tests incorporate MIL-STD-883K and MIL-STD-202H, and the SM Series test chamber can achieve all of the tests required under these two test conditions. See the typical application tab below for detailed information about reaching these test standards in a SM Thermal Shock Test Chamber.
INSTRUMENTATION. SM-1902D Test Chamber incorporates AESONE CONNECT creating a robust connected device giving you a standard and uniform interface that makes operation easier. Learn more in the Instrumentation Tab below.
The images below specify the test conditions the SM Thermal Shock test chamber can achieve under the military and aerospace conditions to adhere to the uniform method for thermal shock testing of microelectronic devices within electronic systems. These devices include monolithic, multi-chip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed.
SM Thermal Shock test chambers are designed to meet Method 107 test conditions A, B, and F when testing electronic and electrical component parts such items as capacitors, resistors, switches, relays, transformers, inductors, and such at weights of 10 or 5 pounds, see images below.
The test method should apply only to small component parts, weighing up to 300 pounds or having a root mean square test voltage up to 50,000 volts unless otherwise specified.
|Exterior:||49W x 62D x 57H (in)|
|1244.6W x 1574.8D x 1447.8H (mm)|
|Volume:||2 cubic ft|
|Electrical Supply:||208VAC or 230VAC, 3PH, 60HZ,|
|Full Load Amps:||50A|
|Mobility:||Will fit through 62" door|
*Rise and pull-down rates calculated using IEC 60068-3-5 standard. Custom options available.
|Standards||MIL-STD 883 K||MIL-STD 2020H|
Basket Weight by Test Method
Tests A, B: 15 lbs (6.8 kg)
Tests C: 10 lbs (4.54 kg)
Test D: Consult Factory
Tests E: 5 lbs (2.3 kg)
Tests A, B: 10 lbs (4.54 kg)
Tests C, D, E: Consult Factory
Tests F: 5 lbs (2.3 kg)
SM Series Test Chambers have incorporated AESONE CONNECT creating a robust connected device for a standard and uniform interface making test chamber operation easier.
AESONE XCHANGE is hardware internal to the chamber that increases your functionality
AESONE SOFTWARE gives you the power to
WATLOW F4T PROGRAMMABLE CONTROLLER. Features a 4.3” capacitive touchscreen minimizing the chance for error. Ethernet communication supported by AESONE HARDWARE. View more controller options
OPTIONAL DATA LOGGERS. View additional data loggers